Module ICE-4323:
Microengineering
Microengineering 2024-25
ICE-4323
2024-25
Ysgol Cyfrifiadureg a Pheirianneg
Modiwl - Semester 1
20 credits
Module Organiser:
Iestyn Pierce
Overview
Indicative content includes:
- Overview and history of microengineering. Example application areas. Advantages and disadvantages of microengineered systems. Current and future markets
- Basic photolithography. Masks, Resist technology, Etching, Exposure sources, resolutions. Emerging technologies, Applications and examples
- Silicon crystallography, mechanical properties of silicon, Etch methods, Etch stops, Examples and applications
- Mechanical properties of thin films. Surface machining processes. Poly-silicon processes, Silicon-on-insulator (SOI) processes. Examples and applications
- Resists and lithography. Electrodeposition processes. Injection moulding. Material properties of polymers, Hot embossing.
- Laser principles. Laser wavelengths and pulse regimes. Beam propagation. Machining techniques. Excimer lasers, Femtosecond laser micromachining.
Learning Outcomes
- Apply principles of Laser Micromachining to common industrial problems, detailing technologies and principles involved.
- Illustrate benefits gained by users of microengineered components over more traditional methods.
- Recognise key aspects and processes within the photolithography process.
- Recognise principles and techniques of bulk and surface micromachining.
Assessment type
Crynodol
Description
Individual Essay
Weighting
40%
Assessment type
Crynodol
Description
Final Exam
Weighting
60%